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SOCKET 370, CPU SPEED 333-766 MHz FSB 66 MHz |
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SOCKET 370 CPUT SPEED 800-1400 MHz FSB 100 MHz |
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SOCKET 370 CPU SPEED 450-850 MHz FSB 100 MHz |
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SOCKET 370 CPU SPEED 533-1400 MHz FSB 133 MHz |
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SOCKET 423 CPU SPEED 1300-2000 MHz FSB 100 (QUAD SPEED)=400 MHz |
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SOCKET 478 CPU SPEED 1700-2800 MHz FSB 100 (QUAD SPEED)= 400 MHz |
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SOCKET 478 CPU SPEED 1300-2000 2200-3000 2600-3400 MHz FSB 100(QUAD SPEED)=400 133(QUAD SPEED)=533 200(QUAD SPEED)=800 MHz |
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SOCKET A/462 CPU SPEED 600-1300 MHz NAME N/A FSB 200 MHz |
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| AMD ATHLON THUNDERBIRD(PGA) |
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SOCKET A/462 CPU SPEED 650-1400 MHz NAME N/A FSB 100 MHz |
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| AMD ATHLON THUNDERBIRD (PGA) |
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SOCKET A/462 CPU SPEED 650-1400 MHz NAME N/A FSB 133 MHz |
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SOCKET A/462 CPU SPEED 1333-2133MHz NAME 1500+ - 2600+ FSB 133 (2X) = 266 |
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SOCKET A/462 CPU SPEED 1833-2166 MHz NAME 3000+ - 3200+ FSB 200(2X)=400 |
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| WHAT IS THE DIFFERENCE BETWEEN 32BIT AND 64BIT PROCESSORS |
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Definition
| THE DIFFERENCE IS THE WAY THEY HANDLE RAM MEMORY. 64BIT VERSION HANDLE LARGE AMOUNT OF MEMORY MORE EFFICENTLY THAN 32 BIT |
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| WHAT IS CACHE AND THE LEVELS OF CACHE |
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Definition
CACHE IS VERY FAST MEMROY L1 CACHE IS 32-64 KB AND PROGRAMED INSIDE THE CPU CHIP THAT HOLDS INSTRUCTION WAITING TO BE PROCESSED L2 CACHE PACKAGED WITH CPU 256KB AND UP L3 CACHE IS USED TO FURTHER INCREASE SPEED |
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| HYPER-THREADING TECHNLOLOGY (HTT) |
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Definition
PROCESS OF ALLOWING A SINGLE PROCESS TO PROCESS MULTIPLE THREADS OF CODE (OS MUST SUPPORT SMP - SYMMETRIC MULTIPROCESSING |
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| What would cause a laptop CPU not to run at full speed. |
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Definition
| because it will automatically throttle back down to run at speed needed to accomplish task |
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| What is overclocking and what does it do. |
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Definition
increases clock speed must have OS that supports overclocking must enter CMOS to change clock speed (increased heat production) |
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| What is the purpuse VRM (Voltage regulator module) |
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Definition
| •A VRM or PPM (processor power module) is an electronic device that provides a microprocessor the appropriate supply voltage. |
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Definition
Central Processing Unit is the brain of the computer. It processes instructions. There are 3 major form factors. 1. Dual-Inline Pin (DIPP 2. Pin Grid Array (PGA) 3. SEC (Single Edge Cartridge) Sep (Single Edge Package) |
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| What is the major form factor for processors used today |
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Definition
| PGA (Pin Grid Array), It has pins that fit into ZIF (zero insertion force) motherboard socket. |
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Definition
| off a host clock set by a timing crystal on motherboard |
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| What is the external bus clock speed referred to |
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Definition
| Front Side Bus Speed(FSB) measured in MHz |
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Definition
| Internal bus, also known as Internal data bus, memory bus or system bus or front-Side-Bus, connects all the internal components of a computer, |
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Definition
| Also known as an "I/O bus," is the data pathway that connects peripheral devices to the CPU |
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| Explain FSB or internal bus speed |
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Definition
| Internal bus speed or FSB is measured in MHz and set by timing chrystal on MB |
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| How does AMD Socket A/462 process instructions |
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Definition
| DDR Ram memory process two instructions per synchronized clock cycle, which doubles the speed of RAM |
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| How does heat sink cook a CPU |
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Definition
Draws heat away from the CPU, there are 2 types passive and active. passive use conductive properties of various metals to draw heat away from CPU. Active uses a fan |
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| What is thernal compound used for. |
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Definition
| to create a good conductive contact between CPU and heat sink compound (zinc oxide or silver |
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| When is liquid cooling system used |
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Definition
| on computers that have been overclocked |
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| What are the effect of thermal issues and what components does it affect. |
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Definition
affect the CPU RAM and video cards afects of over heating spontaneous restarts and shut downs system lockups damaged components |
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| What are the causes of thernal problems |
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Definition
Lack of sufficient cooking (broken or clocked fans) improper application of thermal grease |
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| Memory that need constant electronic charge. If there is no charge data is lost. charge state of capacitor is binary value |
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| Explain Static Random Access Memory (SRAM) |
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Definition
| does not contain capacitors, only resistors. No need to refreash. L1 & L2 cache uses SRAM |
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Definition
| Syncronized with FSB host clock increasing access speed of RAM |
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Term
| Dual Inline Memory Module (DIMM) |
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Definition
| 168 pins, can handle 64 bit wide data path, speed on FSB speed. Most MB support SDRAM rated higher that the max FSB |
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Definition
| DDR/DDR2 - use 184 pin DIMM Chip |
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FSB Speed 100 MHz Module Name PC-1600 |
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FSB Speed 166 MHz Module Name PC-2700 |
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FSB Speed 200 MHz Module Name PC-3200 |
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Term
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Definition
| use a 184-pin form factor with two notches. Must be inserted into MB in matched pairs and empty slots must be filled with special RIMM terminating module called Continuity RIMM (CRIMM) |
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| Small Out-line DIMM (SO-DIMM) |
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Definition
used with Laptop MB use's a 144 or 200 pin |
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